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Fecha de registro: 14 may 2022

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Nov 28, 2014 List of sound artists By Greg Brown - Classified – Category. Toilet Roll Music – List of sound artists – List of sound artists from Australia. Nov 28, 2014 Theatrical Sound Listing of Audio Damage - February 4th, 2014 by Greg Brown - Classified – Category. Toilet Roll Music – List of sound artists – List of sound artists from Australia. Category:Audio engineering Category:Sound recording1. Field of the Invention The present invention relates to a structure for packaging an optical component. In particular, it relates to a structure for packaging an optical component suitable for use as an optical transceiver. 2. Description of the Related Art A semiconductor laser element, a semiconductor device in which a semiconductor laser element is incorporated, or an optical component with a semiconductor device is packaged in various ways. There is a structure in which a housing for accommodating a semiconductor laser element or a housing for accommodating a semiconductor device in which a semiconductor laser element is incorporated is disposed on a mount base made of a resin material. The housings for accommodating the semiconductor laser element and the semiconductor device is located at the outer periphery of the mount base. A portion at which the housings for accommodating the semiconductor laser element and the semiconductor device are located corresponds to the outer periphery of the mount base. A material for the housing for accommodating the semiconductor laser element is different from a material for the housing for accommodating the semiconductor device. A description will now be given of a method for packaging the semiconductor device with reference to FIGS. 16A to 16C and FIGS. 17A to 17C. In the figure, reference numeral 1 denotes a semiconductor device. Reference numeral 2 denotes a resin mold for protecting a semiconductor element which is not shown. Reference numeral 3 denotes a semiconductor element. Reference numeral 4 denotes a housing for accommodating the semiconductor device, and reference numeral 5 denotes a sub-housing which accommodates a semiconductor laser element. Reference numeral 6 denotes a mount base for fixing the semiconductor device, the sub-housing 5 and the housing for accommodating the semiconductor device. The mount base 6 is made of a resin material. When a semiconductor device is fabricated, the semiconductor device 1 and the semiconductor element 3 are first provided. A protective resin 2 is then disposed on the semiconductor device 1 and the semiconductor element 3 and is thereafter

 

 

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